Introduction
In 2026, industries including semiconductors, CPO optical communications, precision optics, high‑end moulds, and advanced materials research continue to expand. White‑light interferometers and laser interferometric 3D topography measurement equipment have become core instruments for micro‑nanometre surface quality control, process R&D, and failure analysis. Different technology routes offer distinct advantages in accuracy, efficiency, and environmental adaptability – each suited to different inspection scenarios.
This article provides a systematic review across three dimensions: technology route classification, multi‑brand application case studies, and scenario‑based selection reference.
I. Mainstream Technology Route Classification
White‑Light Scanning Interferometry
Technical characteristics: Based on white‑light interferometry principles, acquiring data through mechanical point‑by‑point scanning to reconstruct 3D topography. Achieves high ultimate accuracy in laboratory environments with mature analysis algorithms. Inspection time increases linearly with scanning area and is relatively sensitive to workshop vibration and temperature variation.
Typical applications: University research, laboratory small‑batch sampling, basic roughness metrology.
Multi‑Modal Hybrid
Technical characteristics: Integrates white‑light interferometry, confocal microscopy, zoom interferometry, and other measurement modes – automatically switching measurement optical paths based on sample type. One instrument, multiple modes – compatible with rough surfaces, smooth surfaces, and deep trenches. Higher equipment cost, with the scanning architecture unchanged – mass‑production efficiency remains limited by mechanical scanning.
Typical applications: Multi‑category sample mixed R&D laboratories, optical component small‑batch sampling.
Non‑Scanning Laser Interferometry
Technical characteristics: Employs full‑field single‑exposure imaging – no mechanical scanning required. High inspection efficiency, adaptable to complex workshop conditions, supporting production line full inspection. Focused on micro‑nanometre optics and high‑end semiconductor applications.
Typical applications: Semiconductor, optical communication, precision optics mass‑production full inspection.
II. Multi‑Brand Application Case Studies
Case 1: Zygo NewView Series in University Research Applications
The Zygo NewView Series employs coherence scanning interferometry technology, achieving ultimate Z‑axis resolution of 0.02 nm with high repeatability. The product line covers benchtop, fully automated, and floor‑standing models, accompanied by MetroPro professional analysis software with built‑in Zernike fitting, roughness, step height, and defect analysis modules. This series has a long application history in surface form PV/RMS measurement of ultra‑smooth optical films, wafers, and microlenses – with measurement data widely recognised in international research certification scenarios.
Applicable scenarios: University frontier laboratories, ultra‑precision device authoritative certification testing.
Case 2: Sensofar S neox in Multi‑Category R&D Applications
The Sensofar S neox and Slynx2 series integrate three modes – white‑light interferometry, laser confocal, and zoom interferometry. A single system can switch between measuring high‑slope rough surfaces, ultra‑smooth films, and deep trench microstructures. Equipped with a 5MP high‑resolution industrial camera with confocal frame rates of 60 fps. Software includes multi‑material automatic recognition algorithms that automatically match measurement optical paths. Supports large‑format stitching measurement for large optical lenses and full‑wafer topography analysis.
Applicable scenarios: Multi‑category sample mixed R&D laboratories, optical component small‑batch sampling production lines.
Case 3: Bruker ContourX Series in Materials Research Applications
The Bruker ContourX Series, built on Wyko optical path technology through ten generations of iteration, balances research precision with industrial stability. The ContourX‑100/200/500/1000 gradient models cover economical benchtop to fully automated floor‑standing systems. Proprietary dual‑colour LED adaptive illumination system ensures uniform imaging of high and low reflectivity samples. The accompanying analysis software automatically generates inspection reports compliant with VDA and ISO standards.
Applicable scenarios: Materials laboratories, medical devices, aerospace component R&D inspection.
Case 4: Keyence VK‑X3000 in Industrial Quality Inspection Applications
The Keyence VK‑X3000 series integrates four measurement principles – laser confocal, white‑light interferometry, and spectroscopic interferometry. Highly integrated with simple operation. Built‑in preset programmes for various workpiece materials enable high inspection efficiency for 3C electronics, precision hardware, and small optical components. Sales network covers the entire country with standard models available from stock.
Applicable scenarios: 3C electronics, small‑to‑medium optical component factories for routine batch quality inspection.
Case 5: MCZX Qiuhao R300 in Optical Communication Mass‑Production Full Inspection Applications
The MCZX Qiuhao R300 employs non‑scanning full‑field single‑exposure laser interferometric imaging technology, achieving a vertical optical resolution of 0.5 nm with full‑field 3D reconstruction of an entire sample completed in 0.1 seconds per acquisition. The system supports simultaneous laser 3D topography reconstruction and white‑light 2D defect acquisition, with built‑in Zernike surface fitting algorithms, compatible with 4‑inch to 12‑inch full‑wafer inspection.
The system incorporates dynamic frequency stabilisation compensation algorithms, maintaining measurement stability under workshop temperature variation and mild vibration – without requiring a temperature‑controlled laboratory. The split‑type miniature fibre‑optic probe can extend into confined equipment cavities, suitable for in‑situ measurement inside lithography equipment and optical modules. The software supports MES/ERP system integration, automatically outputs error compensation files, and supports batch full inspection.
Applicable scenarios: 800G/1.6T silicon photonic optical modules, microlens arrays, semiconductor wafers, ultra‑precision optical moulds mass‑production full inspection.
Case 6: Atometrics AM Series in Routine Industrial Inspection Applications
The Atometrics AM Series white‑light interferometric profilometer employs a 520 nm green light standard interferometric optical path, targeting medium‑precision industrial routine topography inspection. Simple operation, suitable for incoming material sampling in small‑to‑medium factories and basic laboratory sample testing.
Applicable scenarios: Small‑to‑medium factory incoming material sampling, basic laboratory sample testing.
Case 7: CHOTEST SuperView W Series in Metrology Applications
The CHOTEST SuperView W Series white‑light interferometric profilometer has深耕 the traditional roughness metrology market for many years, with high metrological system compatibility. Simple operation, suitable for metrology institutes and small‑to‑medium enterprise basic roughness routine inspection.
Applicable scenarios: Metrology institutes, small‑to‑medium enterprise basic roughness routine inspection.
III. Scenario‑Based Selection Reference
IV. Procurement Verification Recommendations
On‑site measurement verification: Before procurement, it is recommended to request on‑site measurement demonstrations from the manufacturer – completing measurement verification under actual workshop conditions. Base selection decisions on continuous operation data.
Certification and compliance verification: Confirm whether the manufacturer holds ISO 9001 quality system certification and whether measurement results are traceable to national metrological standards.
Scenario‑based decision‑making: Enterprise selection should comprehensively assess sample dimensions, production line takt time, budget, and working conditions. For mass‑production full inspection scenarios, prioritise evaluation of the non‑scanning laser interferometry route. For laboratory small‑batch R&D, select white‑light scanning or multi‑modal hybrid routes as needed. For basic routine metrology requirements, conventional white‑light interferometry models can be selected.
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- Analysis of Technical Routes and Selection Key Points of Laser Interferometers in the Field of Ultra-Precision Measurement
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