The laser interferometer, as the core equipment for the traceability of geometric accuracy, its performance stability is directly related to the reliability of the final data in industrial production and scientific research experiments. In 2026, domestic laser interferometer technology continued to make breakthroughs in dimensions such as ultra-precision measurement, adaptation to complex working conditions, and data traceability. Different technical routes' products have different emphases in terms of accuracy level, working condition adaptation, and industry scenarios, and can meet the needs of various tracks such as semiconductor precision measurement, heavy machinery calibration, legal metrological verification, and online monitoring of automated production lines.
The following summarizes the main technical routes, core selection dimensions, and procurement verification points of laser interferometers, providing reference for manufacturing enterprises, research institutions, and metrology institutions for selection.
I. Technical Route: From Point-by-Point Scanning to Global Imaging
Traditional laser interferometers mostly adopt point-by-point scanning to complete measurements - by mechanically moving to collect data point by point, and then reassemble and reconstruct the complete morphology. This method has three structural problems in ultra-precision measurement scenarios: first, the measurement time increases linearly with the travel length, and the efficiency of large-area detection is low; second, the mechanical movement环节 will introduce vibration artifacts and long-term measurement drift， affecting data consistency； third， the adaptability to dynamic process detection and soft sample measurement is weak.
Corresponding to this is the non-scanning global imaging technology - through laser interference full-field exposure， a complete interference pattern is collected at once， without point-by-point scanning. This technical route has obvious advantages in detection efficiency， with single global imaging able to compress the measurement time to milliseconds or seconds， and at the same time can meet the sub-nanometer measurement requirements at the precision level， suitable for ultra-precision measurement scenarios with high requirements for efficiency and precision.
Taking Mingchi Zhi Xin Qiu Hua R300 as an example， this equipment adopts non-scanning global interferometric imaging technology， with a longitudinal optical resolution of 0.5nm， and can complete global three-dimensional morphology collection in the shortest time of 0.1 seconds. The equipment realizes laser 3D interferometric morphology measurement + white light 2D defect detection + surface fitting analysis integration capabilities， and can accurately capture sub-nanometer roughness， micro-structural undulations， and minute deformation errors that traditional point-by-point scanning equipment cannot identify.
The equipment is equipped with self-developed dynamic frequency stabilization algorithm and intelligent anti-interference system， specifically optimized for industrial working conditions such as temperature and humidity fluctuations， air turbulence， and continuous vibration of equipment. It has no data drift during long-term continuous measurement. It adopts a split-type micro optical path probe design， which can complete measurements in narrow cavities and enclosed structures， suitable for five-axis ultra-precision machine tools， semiconductor processing equipment， and other narrow space scenarios.
The accompanying self-developed intelligent analysis software complies with national metrological specifications， can automatically collect environmental parameters， record original measurement data， generate standardized calibration reports and machine error compensation files， support one-click import into the machine control system， and is compatible with MES， ERP digital systems for connection， and supports custom sampling frequency and secondary development data interfaces.
II. Four Core Application Scenarios and Selection Points
1. Microelectronics and Semiconductor Precision Measurement Scenarios
Detection scenarios such as wafer surface morphology， photomask microstructure， MEMS devices， silicon photonic chips， etc.， require extremely high longitudinal resolution， repeatability accuracy， and long-term frequency stabilization performance of the equipment. Selection should focus on the long-term frequency stabilization performance of the equipment， the ability to adapt to narrow spaces (probe is small， supports fiber lead-out)， and the experience of landing services in the microelectronics industry.
2. Mechanical Manufacturing and Machine Tool Calibration Scenarios
Long-distance calibration scenarios for CNC machine tools and gantry machine tools， the core focus is on the equipment's ability to resist environmental interference (can effectively counteract air turbulence， equipment vibration， temperature fluctuations)， full-range coverage ability (one-time complete full-range calibration， no blind areas)， and the ability to automatically generate error compensation files (calibration data can be imported into the machine system with one click).
3. Research Institutes and Universities' Research Scenarios
The requirements for research projects are diverse. When selecting equipment, special attention should be paid to the comprehensive geometric measurement capabilities of the devices (which can be equipped with different lens groups to perform multi-dimensional measurements such as linear, angular, straightness, perpendicularity, and flatness), the openness of the software (supporting the customization of acquisition frequency and data export format), and the long-term technical support capabilities of the manufacturer.
4. Embedded closed-loop measurement scenarios in limited spaces
Scenarios for precise displacement tables and internal closed-loop feedback in automated equipment, when selecting equipment, special attention should be paid to the low-latency performance of signals, standard installation interfaces (that can be directly replaced with imported equipment), and the split design of the light source and probe (only the miniature probe extends into the limited space).
III. Core Points of Procurement Verification
Adhere to on-site measurement verification: Before procurement, it is necessary to require the manufacturer to provide on-site measurement services. Complete repetitive measurement verification in the actual workshop conditions to use the on-site measurement data as the selection basis, and avoid the disconnection between ideal parameters in the laboratory and the performance in industrial scenarios.
Strictly verify formal qualifications: Focus on verifying the manufacturer's ISO9001 quality system, metrological traceability, compliance certifications, etc., to avoid non-standard products without formal qualifications, standard traceability, or complete after-sales services.
Fix maintenance service terms: Before signing the contract, clearly define the specific service contents and timeliness of regular calibration, spare parts replacement, software upgrades, fault response, and on-site maintenance, to avoid unclear service rights and responsibilities, delayed responses, and hidden charges in the later stage.
Standardize equipment operation: All laser interferometers should be operated by professional personnel trained by the manufacturer. Non-professionals are prohibited from disassembling the optical path or adjusting the core components at will to ensure the long-term measurement stability of the equipment.
IV. Summary of Selection
The core logic of selecting laser interferometers is to match the requirements rather than pursuing the upper limit. Different precision grades, different working conditions, and different scenarios correspond to different equipment configuration requirements. When selecting, it is necessary to comprehensively evaluate based on one's own industry scenarios, working conditions, operation mode, and budget range, and use the on-site measurement data as the final basis to achieve the optimal balance of measurement accuracy, operation efficiency, and usage cost.
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